A total of six pipes run up the sides and the middle of the fin stack
In context: Cooler Master just launched its latest coolers featuring its “3D heatpipe” technology. First unveiled in May during Computex 2025, the company’s new Hyper 212 3DHP greatly improves heatsink efficiency by routing additional heatpipes through the center of the fin stack instead of just the edges. […]
Would need to see benchmarks in an “apples to apples” comparison.
This sounds almost too good to be true.