A total of six pipes run up the sides and the middle of the fin stack
In context: Cooler Master just launched its latest coolers featuring its “3D heatpipe” technology. First unveiled in May during Computex 2025, the company’s new Hyper 212 3DHP greatly improves heatsink efficiency by routing additional heatpipes through the center of the fin stack instead of just the edges. […]
Would need to see benchmarks in an “apples to apples” comparison.
“Guys, 400 watts of thermal power is…too much!” HB’s Aris Mpitziopoulos opined with a chuckle. “It’s, I think, a little bit lower than the top that Intel CPUs can achieve fully unlocked.”
This sounds almost too good to be true.
Absolute innovation. Nobody has ever done something like this before.
I assume you’re at least partially joking, but being able to make it work for a single tower (if the performance is good and it’s not just marketing) is a bit of genuine engineering innovation
