A collaborative research team has demonstrated what it says is the first monolithic 3D integrated circuit manufactured at a commercial U.S. foundry.
A collaborative research team has demonstrated what it says is the first monolithic 3D integrated circuit manufactured at a commercial U.S. foundry.
Sounds like HBM. Also often the bounding factor is heat, thus dark silicon.
I finally got a chance to read it and while it sounds similar, the above linked is a “true” 3D architecture - that being a monolithic piece manufactured as one unit, and with spectacularly higher vertical connection density than you get in HBM (which is basically a stack of 2D dies with bus connections between layers(oversimplifying)). The team is also working to get vertical oriented logic (!!) as a standard feature with this architecture, which just isn’t possible with HBM. There’s a lot of design aspects taken from HBM assembly it seems, but this is just a very different beast.