A collaborative research team has demonstrated what it says is the first monolithic 3D integrated circuit manufactured at a commercial U.S. foundry.
puf piece. This is some graphene level BS.
Oh man, if this pans out this is huge. Like, next-level evolutions in both density and computing power. Lots of development work before its widespread if it is legit, but for a while it was looking like this was effectively impossible for the sub 30 processes so this is so kickass to see.
Sounds like HBM. Also often the bounding factor is heat, thus dark silicon.
I finally got a chance to read it and while it sounds similar, the above linked is a “true” 3D architecture - that being a monolithic piece manufactured as one unit, and with spectacularly higher vertical connection density than you get in HBM (which is basically a stack of 2D dies with bus connections between layers(oversimplifying)). The team is also working to get vertical oriented logic (!!) as a standard feature with this architecture, which just isn’t possible with HBM. There’s a lot of design aspects taken from HBM assembly it seems, but this is just a very different beast.
