Alphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 1 day agoQualcomm Reportedly Places Advanced Packaging Orders With UMC, Challenging TSMC's "CoWoS" Dominancewccftech.comexternal-linkmessage-square2fedilinkarrow-up16arrow-down10
arrow-up16arrow-down1external-linkQualcomm Reportedly Places Advanced Packaging Orders With UMC, Challenging TSMC's "CoWoS" Dominancewccftech.comAlphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 1 day agomessage-square2fedilink
minus-squareAlphane Moon@lemmy.worldOPMlinkfedilinkEnglisharrow-up2·1 day agoI wonder how much of this was driven by actual lack of capacity for TSMC’s “CoWoS” packaging verses the merits of UMC’s packaging process.
minus-squarevzq@lemmy.worldlinkfedilinkarrow-up2·1 day agoAlmost all of it. But still, not being dependent on as single supplier is a win regardless.
I wonder how much of this was driven by actual lack of capacity for TSMC’s “CoWoS” packaging verses the merits of UMC’s packaging process.
Almost all of it. But still, not being dependent on as single supplier is a win regardless.