Qualcomm has reportedly placed "advanced packaging" orders at UMC, taking the first step towards challenging TSMC's dominance.
  • Alphane Moon@lemmy.worldOPMEnglish
    2·
    1 day ago

    I wonder how much of this was driven by actual lack of capacity for TSMC’s “CoWoS” packaging verses the merits of UMC’s packaging process.

    • vzq@lemmy.world
      2·
      1 day ago

      Almost all of it. But still, not being dependent on as single supplier is a win regardless.