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I wonder what the end game is now that we are stacking chiplets onto substrates to build processors. Chips with heat pipes and power delivery integrated within the layers?
TSMC is working on channels for liquid cooling build into chips, so we’ll probably submerge future ones
lmao, sorry but I can’t help myself, this feels like taiwan’s baiting USA like: “hey US, I bet your greedy fucks over there wants this, it’ll be such a shame if you wont ACT NOW and all of this goes to waste dont cha think?”
also don’t get me wrong due to this might be taken out of context, I wont side to US or china or any dbag nations because they’re all ehh…
NVIDIA is pretty much doing the same thing. Blackwell dies are colossal and getting bigger.
