Rekall Incorporated@piefed.socialM to Hardware@lemmy.worldEnglish · 19 days agoIntel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneckwww.tomshardware.comexternal-linkmessage-square0fedilinkarrow-up122arrow-down11file-text
arrow-up121arrow-down1external-linkIntel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneckwww.tomshardware.comRekall Incorporated@piefed.socialM to Hardware@lemmy.worldEnglish · 19 days agomessage-square0fedilinkfile-text
